The MEI202 Bond Pull Tester is a simple reliable pull system ideal for use in labs, QC, process control or production. This simple system allows operators or engineers to operate system with a minimum of training.
The MEI202 meets destruct requirements for Quality or Process control. In the non-destruct mode it verifies bond integrity without degrading acceptable bonds that meet minimum pull strength requirements. Motorized Z control insures rapid testing. Reliable 100% repeatability with minimum operator training. Simple easy adjustment permits selection of destruct or non-destruct operation.
Standard Features
6:1 Micropositioner
Motorized Z control
Constant torque pull test
MIL-STD 883 A,B & C
Non-destruct or destruct
Typical Options
Lighting high intensity, fluorescent, or fiber optics
Wide range of cold workstages
Pull ranges, .5-5g,3-30g,5-50g.10-100g,25-150g,100-500g,1000g
Tweezer pull
Chip attach: 1000g or 2000g gram gauge
