Marpet Enterprises, Inc.


MEI8010		The MEI8010-1and MEI9010-1 automatic wirebonder represents MEI's latest innovation in assembly technology. This series of wirebonders combines the simplicity and reliability of MEI's bonder technology with the latest capabilities in computer control.
The MEI705 Automatic/Semi - Automatic Eutectic Die Attacher represents MEI's latest innovation in assembly technology. This series of die attachers combines the simplicity and reliability of MEI's bonder technology with the latest capabilities in control systems. These systems are ideally suited for microwave devices, laser diodes, leadframes and many single and two chip eutectic applications.
The MEI8010-1 automatic wirebonder represents MEI's latest innovation in assembly technology. This series of wirebonders combines the simplicity and reliability of MEI's bonder technology with the latest capabilities in computer control. These systems are ideally suited for MCM's, hybrids, microwave devices, flat panel displays and other complex applications. The system can be configured to operate at five capillary lengths 0.437", 0.470", 0.625", 0.750" and 1.0" feed for deep access. The MEI8010-1 is a PC based system with software written in C++. All motors and solenoids are controlled by the PC through boards mounted within the PC. The user interface is through menus on an SVGA monitor with a full 101 key keyboard and trackball. The system includes both internal and external storage capability.
MEI9010-1
The MEI9010-1 automated wirebonder represent MEI's latest innovation in assembly technology. This wirebonder combines the simplicity and reliability of MEI's bonder technology with the latest capabilities in computer control. The systems are ideally suited for MCM's, hybrids, microwave devices, flat panel displays and other complex applications. The MEI9010-1 is a PC based system. The system software is written in C++. All motors and solenoids are controlled by the PC through boards mounted within the PC. The user interface is through menus on a SVGA monitor with a full 101 key keyboard and trackball. The system includes both internal and external storage capability. Rather than performing a ground up redesign of the wirebonders it was decided that upgrading the control systems was the proper path to take. While upgrading the control system, great effort was put into maintaining the simplicity and reliability of the bond head and positioning system. The path we chose in the upgrading of the control system was to utilize the wide range of PC compatible devices available today. We took advantage of the significant advances in the PC compatible motion control systems and digital I/O components. The current availability of these products made implementing a PC compatible system the most reliable cost effective method of upgrading our existing designs. Thus eliminating the need to design and manufacture of custom motion controls, and I/O systems. This allowed us to concentrate on the specifics of bonder performance and features. Two additional benefits of utilizing third party components are reliability and cost control. OEM suppliers concentrate on motion control or I/O products and build vast quantities of these products. We benefit from the testing and experience of this large installed base. Also since these OEM suppliers are building large quantities of these components we benefit from the competitive pricing. This also minimizes our assembly, test and design time. Since most of the component plug directly into the mother board of the PC the number of external interconnects is drastically reduced. Lowering the number of connections and the number of cables simplifies the manufacture of the machine while increasing the reliability. MEI705. The MEI705 Automatic/Semi - Automatic Eutectic Die Attacher represents MEI's latest innovation in assembly technology. This series of die attachers combines the simplicity and reliability of MEI's bonder technology with the latest capabilities in control systems. These systems are ideally suited for microwave devices, laser diodes, leadframes and many single and two chip eutectic applications. Standard features include heated indexers, mechanical scrub, hot gas, and manual die targeting. The basic MEI-705 offers the user a semi - automatic system that will provide significant increases accuracy, throughput, quality, and consistency. The system may be upgraded in steps by the addition of a film frame holder with die ejector, and pattern recognition to provide a fully automatic die attach system. The MEI-705 is a PLC based system with software written in ladder logic. All solenoids are controlled by the PLC through boards input/output modules within the PLC. The MEI-705 is designed for eutectic and solder die attach of single and two chip devices.
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