MEI develops and manufactures wire bonders, die attach equipment, both manual and automatic, which is specifically designed to meet our customers process and applications requirements. We have developed equipment for such well known companies as Raytheon, Hewlett Packard, Westinghouse, Macom, and Texas Instruments. Our equipment is specifically engineered not only to meet their applications needs but to provide simplicity of use - flexibility - and ease of maintenance within a competitive price structure.